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february 2011 doc id 9472 rev 5 1/11 11 stps1150 power schottky rectifier features negligible switching losses low forward voltage drop for higher efficiency and extented battery life low thermal resistance surface mount miniature package avalanche capability specified description these 150 v power schottky rectifiers are suited for switch mode power supplies on up to 24 v rails and high frequency converters. packaged in stmite/stmite flat, sma and axial, this device is intended for use in consumer and computer applications like tv, stb, pc and dvd where low drop forward voltage is required to reduce power dissipation. table 1. device summary i f(av) 1 a v rrm 150 v t j (max) 175 c v f (max) 0.67 v k a k a k a sma (jedec do-214ac) stps1150a do-41 stps1150 stmite (jedec do-216aa) stps1150m stmite flat stps1150mf www.st.com
characteristics stps1150 2/11 doc id 9472 rev 5 1 characteristics to evaluate the conduction losses use the following equation: p = 0.59 x i f(av) + 0.08 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 150 v i f(rms) forward rms current 15 a i f(av) average forward current stmite/flat t c = 160 c = 0.5 1 a sma t l = 160 c = 0.5 do-41 t l = 150 c = 0.5 i fsm surge non repetitive forward current stmite/flat t p = 10 ms sinusoidal 50 a sma 50 do-41 75 p arm repetitive peak avalanche power tp = 1s tj = 25 c 1500 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 175 c 1. condition to avoid runaway for a diode on its own heatsink d ptot dtj - -------------- 1 rth j a ? () ------------------------- - < table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case stmite/stmite flat 20 c/w r th(j-l) junction to lead sma 20 lead length = 10 mm do-41 30 table 4. static electrical characteristics symbol parameter tests co nditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 0.2 1.0 a t j = 125 c 0.2 1.0 ma v f (2) forward voltage drop t j = 25 c i f = 1 a 0.78 0.82 v t j = 125 c 0.62 0.67 t j = 25 c i f = 2 a 0.85 0.89 t j = 125 c 0.69 0.75 1. t p = 5 ms, < 2% 2. t p = 380 s, < 2%
stps1150 characteristics doc id 9472 rev 5 3/11 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p (w) f(av) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.0 0.2 0.4 0.6 0.8 1.0 1.2 i (a) f(av) t =tp/t tp = 1 = 0.5 = 0.05 = 0.1 = 0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 175 stmite and stmite flat r th(j-a) = r th(j-c) sma r th(j-a) = r th(j-l) do-41 r th(j-a) = r th(j-l) r th(j-a) = 250 c/w r th(j-a) = 120 c/w t = t / t p t p i (a) f(av) t (c) amb figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm figure 5. non repetitive surge peak forward current versus overload duration - maximum values figure 6. non repetitive surge peak forward current versus overload duration - maximum values 0 2 4 6 8 10 12 14 16 18 20 1.e-03 1.e-02 1.e-01 1.e+00 stmite i (a) m t(s) i m t = 0.5 t = 25 c c t = 75 c c t = 125 c c 0 2 4 6 8 10 12 14 16 18 20 1.e- 03 1.e- 0 2 1.e- 0 1 1.e+ 00 stmite flat i (a) m t(s) i m t = 0.5 t = 25 c c t = 75 c c t = 125 c c
characteristics stps1150 4/11 doc id 9472 rev 5 figure 7. non repetitive surge peak forward current versus overload duration - maximum values figure 8. non repetitive surge peak forward current versus overload duration - maximum values figure 9. relative variation of thermal impedance junction to case versus pulse duration figure 10. relative variation of thermal impedance junction to case versus pulse duration i (a) m 0 1 2 3 4 5 6 7 8 1.e-03 1.e-02 1.e-01 1.e+00 t =25c a t =75c a t =125c a i m t =0.5 t(s) sma 0 1 2 3 4 5 6 7 8 1.e-03 1.e-02 1.e-01 1.e+00 i (a) m t =25c a t =75c a t =125c a i m t =0.5 t(s) do-41 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 stmite z/r th(j-c) th(j-c) single pulse t (s) p 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 stmite flat z/r th(j-c) th(j-c) single pulse t (s) p figure 11. relative variation of thermal impedance junction to ambient versus pulse duration figure 12. relative variation of thermal impedance junction to ambient versus pulse duration 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 sma z/r th(j-a) th(j-a) single pulse t (s) p 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-a) th(j-a) single pulse t (s) p do-41
stps1150 characteristics doc id 9472 rev 5 5/11 figure 13. reverse leakage current versus reverse voltage applied (typical values) figure 14. junction capacitance versus reverse voltage applied (typical values) i (a) r 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 0 25 50 75 100 125 150 t =125c j t =150c j t =100c j t =50c j t =25c j t =75c j v (v) r c(pf) 1 10 100 1 10 100 1000 f=1mhz v =30mv t =25c osc rms j v (v) r figure 15. forward voltage drop versus forward current (all packages) figure 16. thermal resistance junction to ambient versus copper surface under tab (stmite) i (a) fm 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 v (v) fm t =125c (maximum values) j t =125c (typical values) j t =25c (maximum values) j 0 25 50 75 100 125 150 175 200 225 250 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 stmite r (c/w) th(j-a) s (cm2) cu epoxy printed circuit board, copper thickness = 35 m figure 17. thermal resistance junction to ambient versus copper surface under tab (stmite flat) figure 18. thermal resistance junction to ambient versus copper surface under each lead (sma) 0 25 50 75 100 125 150 175 200 225 250 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 stmite flat r (c/w) th(j-a) s (cm2) cu epoxy printed circuit board, copper thickness = 35 m r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s (cm2) cu epoxy printed circuit board, copper thickness = 35 m
characteristics stps1150 6/11 doc id 9472 rev 5 figure 19. thermal resistance versus lead length (do-41) r (c/w) th 0 20 40 60 80 100 120 5 10152025 l (mm) leads r th(j-i) r th(j-a)
stps1150 package information doc id 9472 rev 5 7/11 2 package information band shows cathode. epoxy meets ul94, v0 in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 20. footprint (dimensions in mm) table 5. stmite dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.85 1.00 1.15 0.033 0.039 0.045 a1 -0.05 0.105 -0.002 0.004 b 0.40 0.65 0.016 0.025 b2 0.70 1.00 0.027 0.039 c 0.10 0.25 0.004 0.010 d 1.75 1.90 2.05 0.069 0.007 0.081 e 1.75 1.90 2.05 0.069 0.007 0.081 h 3.60 3.75 3.90 0.142 0.148 0.154 l 0.50 0.63 0.80 0.047 0.025 0.031 l2 1.20 1.35 1.50 0.047 0.053 0.059 l3 0.50 ref 0.019 ref r 0.07 0.003 r1 0.07 0.003 c l2 l a1 r1 r 0 to 6 b h b2 d l3 a e 1.82 2.03 1.10 0.50 1.38 0.75 0.71
package information stps1150 8/11 doc id 9472 rev 5 figure 21. footprint dimensions table 6. stmite flat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 d 1.75 1.90 2.05 0.069 0.075 0.081 e 3.60 3.80 3.90 0.142 0.150 0.154 e1 2.80 2.95 3.10 0.110 0.116 0.122 l 0.50 0.55 0.80 0.020 0.022 0.031 l1 2.10 2.40 2.60 0.083 0.094 0.102 l2 0.45 0.60 0.75 0.018 0.024 0.030 l3 0.20 0.35 0.50 0.008 0.014 0.020 e1 e c d b l3 a l l1 l2 b2 0.85 0.63 2.00 millimeters (inches) 4.13 0.95 1.95 0.65 0.65 (0.033) (0.079) (0.037) (0.077) (0.026) (0.163) (.025) (.026)
stps1150 package information doc id 9472 rev 5 9/11 figure 22. footprint (dimensions in mm) table 7. sma dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 table 8. do-41 (plastic) dimensions ref. dimensions millimeters inches min. max. min. max. a 4.1 5.20 0.160 0.205 b 2 2.71 0.080 0.107 c25.4 1 d 0.712 0.863 0.028 0.034 e c l e1 d a1 a2 b 2.63 5.43 1.4 1.64 1.4 ?d ?b a cc
ordering information stps1150 10/11 doc id 9472 rev 5 3 ordering information 4 revision history table 9. ordering information order code marking package weight base qty delivery mode stps1150m 115 stmite 0.0155 g 12000 tape and reel stps1150mf f115 stmite flat 0.016 g 12000 tape and reel stps1150a 1150 sma 0.068 g 5000 tape and reel stps1150 stps1150 do-41 0.34 g 2000 ammopack stps1150rl stps1150 do-41 0.34 g 5000 tape and reel table 10. document revision history date revision changes jul-2003 2a last update. aug-2004 3 sma package dimensions update. reference a1 max. changed from 2.70mm (0.106) to 2.03mm (0.080). 31-may-2006 4 reformatted to current standard. added ecopack statement. updated sma footprint in figure 15. changed nf to pf in figure 10. 09-feb-2011 5 added stmite and stmite flat package.
stps1150 doc id 9472 rev 5 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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